Bringing Packaging Automation Solutions to PACK EXPO
“Tell us about your toughest packaging automation challenge.”

That was our welcoming statement to booth visitors at the recent PACK EXPO event in Las Vegas, where more than 30K attendees converged to find the latest technologies and solutions to all their packaging challenges. And once we knew their particular issue, we could follow up with multiple solutions as Bishop-Wisecarver has been in business nearly 70 years and has worked with the packaging industry since that first decade.

With multiple patents showing our experience, and several engineers on hand that love to solve problems, the discussions in the booth were interesting for both our team and the customers.
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